RNX-i.MX93-OSM – SoM with NXP i.MX93 in OSM form factor

  • OSM Size-L, 45x45mm
  • Dual-core ARM Cortex-A55 CPU, 1.7GHz
  • Arm® Ethos™ U-65 microNPU, 0.5 TOP/s
  • ARM Cortex-M33 250MHz
  • OSM Size-L, LGA 45x45mm
  • Yocto, Linux, U-BOOT

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The RNX-i.MX93-OSM is a Solderable System on Module (SoM) based on NXP i.MX93 family – a 1.7 GHz Dual-core ARM Cortex-A55™ processor integrated with a NPU of 0.5 TOP/s that greatly accelerate machine learning inference. For industrial applications, real time control is enabled by an integrated Arm® Cortex®-M33 running at 250MHz. The SoM is in compliance with OSM (Open Standard Module™) specification OSM Size-L.

Form factor:

  • Open Standard Module™ (OSM)
  • Size-L, 45x45mm
  • LGA 662, solderable

CPU i.MX93:

  • Dual-core ARM Cortex-A55 CPU, 1.7GHz
  • Arm® Ethos™ U-65 microNPU
  • ARM Cortex-M33 250MHz
  • EdgeLock® secure enclave
  • 2D GPU: blending/composition, resize, color space conversion


  • RAM: 1 GiB, LPDDR4
  • eMMC: 4 GiB (optional: up to 64 GiB)


  • 1080p60 MIPI-DSI (4-lane, 1.5Gbps/lane) with PHY
  • 720p60 LVDS (4-lane)


  • 1080p60 MIPI-CSI (2-lane, 1.5Gbps/lane) with PHY


  • Ethernet: 2xRGMII 10/100/1000Mbps
  • WiFi: SparkLan AP6275SDSR or AzureWave AW-CM276NF, 802.11ax, dual-band (optional)
  • Bluetooth: Bluetooth 5.0 Secure Connection Compliant (optional)


  • 4x USB2.0 (with USB hub)
  • 2x USB2.0 (without USB hub)
  • Up to 5x UART ports
  • 2x SPI
  • 2x I2C
  • 2x CAN
  • Up to 4x general purpose PWM signals
  • GPIOs

Electrical specifications

  • Supply Voltage: 5.0V


  • Form factor: OSM Size-L, 45x45mm
  • Operation temperature: 0° +70°C, -40° to 85° C (optional)
  • Relative humidity: 10% to 90%
  • MTTF > 200000 hours


Carrier board



📄 RNX-i.MX93-OSM_Datasheet.pdf

📄 U-BOOT, Linux Kernel, YOCTO

Development Tools


🔗 http://wiki.ronetix.at/